BTU International to Participate in ACI Technologies’ Technical Exposition

NORTH BILLERICA, Mass., May 12, 2014— BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will participate in ACI Technologies’ Technical Exposition, scheduled to take place May 14-15, 2014, at the ACI facility in Philadelphia, PA. The free two-day event will feature equipment demonstrations and technical presentations.

Mastering the solder paste reflow profile is usually the last step to locking down the SMT assembly. An industry expert from BTU will discuss the development of reflow profiles for printed circuit board solder reflow, semiconductor packaging and lead-free processes.

To register for the event, contact Katie Riggan by phone at 610.362.1200, extension 250 or via email at Please note that capacity is limited, so reserve your place today. For more information on the ACI Technologies’ Technical Exposition, the complete agenda can be seen here.

For more information about BTU International, visit

About BTU International

BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe. Information about BTU International is available at


Company Contact:

Jim Griffin
Vice President Sales and Service
BTU International, INC.
Tel: 978.667.4111

Media Contact:

Megan Wending
MW Associates
Tel: 239.537.6001