BTU International to Discuss Heavy Board Reflow Solutions for AI Server Applications at SMTA Houston and Austin Expos

NORTH BILLERICA, Mass., January 27, 2026 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Houston Expo & Tech Forum on February 10, 2026, and the SMTA Austin Expo & Tech Forum on February 12, 2026. At both events, Marcos Perez, Regional…

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BTU International’s Aurora 200N Takes Home 2025 Global Technology Award for Reflow Innovation

WESTFORD, Mass., November 19, 2025 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that its Aurora 200N Reflow Oven has been honored with a 2025 Global Technology Award in the category of Soldering Equipment – Reflow. The award was presented during a…

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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System

WESTFORD, Mass., October 29, 2025 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens. The award was presented on October 28th…

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BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain

WESTFORD, MA – October 20, 2025 – BTU International, a leading global supplier of advanced thermal processing equipment for electronics assembly, today announced plans to expand its manufacturing operations into Singapore. This strategic expansion is designed to mitigate risk, reduce tariff exposure, and enable BTU’s Shanghai facility to increase production and add new product lines…

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BTU International Brings High-Performance, Energy-Efficient Reflow Solutions to productronica 2025

WESTFORD, Mass., October 16, 2025 BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at productronica 2025, taking place November 18–21 at Messe München in Munich, Germany. Visitors can find BTU at Hall A3, Stand 103, where the company will showcase its newest model, the Aurora…

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BTU International Showcases Advanced Reflow Strategies for Panel-Level Packaging at CSEAC 2025

BTU International, a leading provider of advanced thermal processing equipment, unveiled its latest innovations in wafer bumping reflow technology at the China Semiconductor Executive Assembly Conference (CSEAC) 2025. Thomas Tong, Process Technology Manager at BTU, presented a comprehensive approach to optimizing reflow processes for reliable wafer bumping in Panel-Level Packaging (PLP), a critical step in…

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