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Operation of a Vacuum Reflow Oven With Updated Void Reduction Data
When : November 20th @ 11:00 AM Presenter : Fred Dimock of BTU
Abstract : This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry. Additionally, Dimock will present a report on data from a vacuum reflow void reduction experiment completed at the Universal Instruments Process Laboratory and subsequent trials at ACI Technology. |
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