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Wafer Level Packaging

Wafer Level Packaging

SECAP – 2005 — A collection of papers on wafer level packaging and flip chip bumping covering a range of topics including plating, UBM, photolithography, and lead-free processing. As a member of SECAP, BTU contributed a paper on Next Generation Wafer Bump Reflow Processing.

  • Date: February 3, 2015
  • Type: application/pdf
  • Size: (2.9 MB)