electronic components. Typically these applications require high productivity and excellent process control. BTU’s convection reflow ovens are used for printed circuit board assembly, semiconductor packaging, and LED assembly among other applications.
In printed circuit board assembly, surface mount technology SMT reflow is performed by BTU’s Pyramax convection reflow oven. The Pyramax is known worldwide as the performance leader. With closed loop convection control the Pyramax reflow oven offers the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line. For semiconductor packaging, BTU offers nitrogen processing using the Pyramax convection reflow oven with astounding atmosphere purity with O2 levels as low as 2ppm above source in the peak zones.
Pyramax reflow ovens beat the competition in thermal uniformity, repeatability and exit temperature – even at higher throughput.
BTU is focused on minimizing Total Cost of Ownership for the reflow process. Our formula is built upon the foundation of the most reliable and repeatable/highest yield system in the industry. We then attack process set-up time through our innovative RecipePro software – the only reflow oven recipe generator to include convection rate in the algorithm, the most important aspect of heat transfer in a convection reflow oven. Next, we take on the running cost of the solder reflow oven by automatically lowering the power and process gas consumption during idle time using our EnergyPilot software. The Pyramax’s industry-leading “true” ready time allows the oven to recover and reach process stability in record time – enabling the savings without impacting productivity and throughput.
BTU’s ovens and furnaces are the industry’s process and productivity leaders and have tens of thousands of installations. Contact BTU with any questions or to learn about the latest advancements in reflow ovens, furnaces, or SMT reflow oven technology.
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