BTU Accepts 5th Award for Vacuum Reflow Oven

NORTH BILLERICA, Mass., November 17, 2021 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Reflow Ovens for its PYRAMAX™ Vacuum Reflow Oven. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany. This is the fifth global award that BTU has received for the PYRAMAX Vacuum.

“Vacuum reflow technology is a proven method for virtually eliminating voids,” said Rob DiMatteo, General Manager of BTU International.  “Our Pyramax Vacuum Reflow serves some of the most demanding applications in the industry, we proud to offer this enabling technology,” added DiMatteo.

The PYRAMAX Vacuum reflow oven has been designed to meet the solder voiding requirements and high-volume demands of electronics assembly and semiconductor packaging applications. The unit is configured with 10 zones of closed-loop convection heating, two zones of convection vacuum chamber heat assist and an internal vacuum chamber heater for precise profile control.  Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C.

The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The prestigious awards contest has been bringing together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net/awards.

To learn more visit www.btu.com.

About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. For front-end semiconductor processing the BTU BDF 300 is the market leading solution for 300mm horizontal diffusion furnaces. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

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Company Contact:
Rob DiMatteo
General Manager
BTU International, Inc.
Phone: +1- (978) 667-4111

Media Contact:
Megan Wendling
MW Associates
Phone: +1-(239) 530-8790