Menu

Improving Reflow wSPC Part I

Improving Reflow wSPC Part I

Circuits Assembly – Dec 2001 — First of a three-part series on using SPC to improve the reflow process. In this article analytical tools are used to determine how all oven parameters are operating at the time an optimum oven profile is established.

  • Type: application/pdf
  • Size: (227.3 KB)