BTU’s Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly.
Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate productivity and efficiency. BTU’s exclusive closed-loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10, and 12-zone air or nitrogen models, 350oC maximum temperature, and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.
WINCON Oven Control System
The Pyramax solder reflow oven features BTU’s proprietary WINCON™ software, the world’s most powerful solder reflow oven control system. WINCON features a simplified user interface and incredibly powerful reflow soldering analytical capabilities. The latest versions of WINCON include BTU’s cost-saving Energy Pilot feature as well as the RecipePro recipe generator platform. Energy Pilot and RecipePro allow users to minimize the total Cost of Ownership. Energy Pilot reduces running costs automatically during idle times and RecipePro attacks set-up time by generating a starting recipe when setting up a new process.
Watch the video below to see how the Pyramax reflow system and reflow oven outperforms the competition on uniformity, throughput and exit temperature.
BTU’s Pyramax™ family of products is backed by its industry-leading comprehensive warranty:
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