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Pyramax technology to minimize warpage
Very thin substrates can often not withstand thermal processing. Thermal processing can lead to unacceptable board warpage and very low manufacturing yields.
TrueFlat technology uses the Pyramax platform to simultaneously employ both convection heating and suction to keep the substrate flat. The suction is applied throughout the entire heating and cooling cycle eliminating the possibility of warpage due to thermal cycling. This technology can be used for board thicknesses from 0.15mm to 0.30mm thick.
Download the brochure to learn more about eliminating board warpage with Pyramax Trueflat.