Oven Selection and Lead-Free Solder
Global SMT & Packaging - Oct 2004 --- A discussion on the oven requirements for lead free solder. This article discusses issues like oven length, thermal capacity, speed, zones, flux management, board support mechanisms, the use of nitrogen, and convection control.
"*" indicates required fields
Contact Us
How can we help you?
Email
Customer Support
Corporate Brochures
BTU Capabilities
Download