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Pyramax Vacuum Reflow Oven
BTU’s Pyramax Vacuum reflow oven is a leading choice for manufacturers that need to minimize solder voiding. Solder voiding can be a life-limiting defect in assemblies where heat dissipation is a critical factor. Pyramax Vacuum has demonstrated its ability to reduce voiding levels well below 5%. BTU partnered initially with the Universal Advanced Process lab for performance validation. Now interested customers can process their own boards on a Pyramax Vacuum reflow oven at the American Competitiveness Institute, ACI, in Philadelphia, PA. The change from conventional reflow to vacuum reflow requires some process development, we are prepared to support both process validation and development with our partnership at ACI. To learn more about Pyramax Vacuum download the brochure today.