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BTU International to Showcase High-Reliability Reflow Solutions at SMTA Space Coast
WESTFORD, Mass., October 19, 2026 – BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor packaging markets, will showcase its high-reliability reflow solutions at the SMTA Space Coast Expo and Technical Forum, taking place November 11 at the Melbourne Auditorium in Melbourne, Florida. The company will highlight its…
Read MoreExatronic Strengthens Reflow Process Control with BTU International and iRaptor Technology
Investment in advanced thermal processing and Profile Tracer 4D supports repeatability, process optimisation and demanding electronics manufacturing requirements WESTFORD, MA – October 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing industry, is highlighting the successful implementation of its Pyramax reflow technology at Portuguese electronics engineering and…
Read MoreBTU International Wins 2026 Mexico Technology Award for Aurora Vacuum™ Reflow Innovation
WESTFORD, Mass., October 8, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced that its Aurora Vacuum™ Reflow Oven received a 2026 Mexico Technology Award in the Reflow category. The award was presented during a ceremony held before SMTA Guadalajara 2026 on Wednesday, October 7, 2026, in Guadalajara, Jalisco,…
Read MoreBTU International to Discuss Heavy Board Reflow Solutions for AI Server Applications at SMTA Long Island
FOR IMMEDIATE RELEASE Westford, Mass. — Sept. 18, 2026 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Long Island Table-Top Expo on October 1, 2026. At the event, Robert Bouchard, Director of Sales for BTU, will discuss reflow solutions designed to…
Read MoreBTU International Showcases Aurora™ Reflow Solutions for Large AI Server Boards and High-Throughput Vacuum Processing at SMTA Guadalajara
WESTFORD, Mass., September 1, 2026 –BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor packaging markets will exhibit at SMTA Guadalajara 2026, taking place October 7-8th in Guadalajara, Mexico. Attendees can visit BTU at Booth 745 at Expo Guadalajara, where the company will showcase its latest Aurora reflow technology tailored for heavy boards and high-yield applications. Highlighted in the booth will…
Read MoreBTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing
WESTFORD, Mass., August 24, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies. As AI infrastructure, automotive electronics, advanced packaging, and…
Read MoreBTU Introduces High-Yield Reflow Technologies for Advanced Packaging at SEMICON Taiwan
WESTFORD, Mass., August 26, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, will showcase its latest high-yield reflow technologies at SEMICON Taiwan in Booth I2516, with a focus on advanced packaging and other high-density applications. BTU’s booth is collocated with trusted representative, CohPros International. Visitors will have the…
Read MoreBTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging
WESTFORD, Mass., August 21, 2026 –BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, today announced the availability of an advanced Formic Acid Reflow capability across multiple reflow oven platforms. Designed to support the increasing demands of advanced semiconductor packaging, power devices, and high-reliability electronic assemblies, the new process option enables fluxless soldering while…
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