BTU International to Discuss Heavy Board Reflow Solutions for AI Server Applications at SMTA Houston and Austin Expos
NORTH BILLERICA, Mass., January 27, 2026 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Houston Expo & Tech Forum on February 10, 2026, and the SMTA Austin Expo & Tech Forum on February 12, 2026. At both events, Marcos Perez, Regional Sales Manager for BTU, will discuss reflow solutions designed to support the growing demands of AI server board manufacturing, including heavy, high-thermal-mass assemblies.
BTU will highlight its Aurora reflow platform, including extended-length configurations and systems engineered for heavy board loads. These configurations are designed to provide the thermal stability, throughput, and process control required for today’s large, complex AI server boards and data center hardware.
“I’m looking forward to meeting with key customers in Texas,” said Marcos Perez, Regional Sales Manager for BTU International. “This region is going to be critical in the buildout of AI infrastructure. Our reflow ovens lead the industry in performance for heavy-load applications such as AI server boards, which are a critical step in that buildout.”
AI server assemblies present unique reflow challenges due to high copper content, thick substrates, dense component populations, and uneven thermal mass distribution. BTU’s Aurora and Pyramax reflow ovens are engineered to address these challenges through a system-level thermal architecture that delivers uniform heating, precise profile control, and repeatable results—without sacrificing throughput or process window.
Rather than relying on brute-force heat alone, BTU reflow systems are designed to manage energy delivery across the entire oven, ensuring consistent soldering performance across a wide range of board sizes, weights, and constructions. This approach allows manufacturers to run complex, high-mass boards alongside other products with confidence, supporting both NPI and sustained production environments.
BTU representatives will be available at both events to discuss heavy board reflow strategies, AI server manufacturing challenges, and how Aurora’s longer-length and heavy-load configurations can be tailored to specific production requirements.
SMTA Houston Expo & Tech Forum
Date: Tuesday, February 10, 2026
Time: 8:30 AM – 5:00 PM (CT)
Location: Stafford Centre
10505 Cash Road
Stafford, TX 77477
SMTA Austin Expo & Tech Forum
Date: Thursday, February 12, 2026
Time: 9:00 AM – 3:00 PM (CT)
Location: Travis County Exposition Center
7311 Decker Lane
Austin, TX 78724
For more information about BTU International and its heavy board reflow solutions, visit www.btu.com.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
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Company Contact:
Rob DiMatteo
General Manager
BTU International, Inc.
Phone: +1- (978) 667-4111
Media Contact:
Megan Wendling
MW Associates
Phone: +1-(239) 530-8790
