BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader in advanced thermal processing equipment for electronics and semiconductor applications.
BTU’s reflow ovens are recognized as the performance leader offering exceptional process repeatability and productivity. These ovens play a key role in advanced packaging for AI and high-performance computing chips, with innovative solutions such as the TrueFlat reflow oven, specifically designed to process very thin substrates with exceptional flatness and uniformity – eliminating failure modes such as die tilt.
The company’s high-performance convection reflow ovens are also widely used in surface mount technology (SMT) for printed circuit board assembly with exceptional capability for heavy boards and other extreme use cases. In addition, BTU provides high-temperature belt furnaces and horizontal diffusion furnaces for semiconductor device fabrication.
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BTU has operations in Westford, MA, USA, and Shanghai, China, with a sales and service presence in over 30 countries. Since 1950, and with over 10,000 units shipped, BTU International has been the trusted name for high-tech thermal processing solutions customers with a need to solve high-volume thermal processing challenges. BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. Our extensive patent library includes traveling gas barrier technology among other advances.
BTU is an ISO certified company in both the USA and China manufacturing facilities.
As we stand at the forefront of innovation in our industry, we recognize our pivotal role in fostering a sustainable and equitable future. Our approach focuses on embedding responsibility into the core of our operations and continuously improving our practices.
BTU's Quality Policy ensures adherence to a worldwide Quality Management System at all of BTU's facilities.
BTU is part of the Amtech Group
Founded in 1981, Amtech Systems is a global supplier of manufacturing equipment and materials for electronic assembly and semiconductor substrate processing. Our reflow equipment is used for advanced semiconductor packaging and demanding electronic assembly applications. Our consumables, parts and services support Chemical Mechanical Planarization (CMP) of conventional and advanced substrates.
Our business segments are made up of our four wholly owned subsidiaries, which manufacture and sell our products under the leading premier brand names: BTU International, Entrepix Inc., PR Hoffman™, and Intersurface Dynamics.
BTU has been a technology leader in the field of thermal process systems since 1950. BTU’s systems are used for semiconductor, advanced packaging, electronics assembly and materials processing.
PR Hoffman offers complete lapping, grinding and polishing machine product lines for a variety of manufacturing processing needs for applications such as SiC, quartz, optics, semiconductor, LED, electronics, ceramics and metalworking.
Founded in 1968, Entrepix, Inc.is a globally recognized expert in chemical mechanical polishing (CMP) and wafer cleaning. Entrepix offers capital equipment, upgrades and related services for the silicon and compound semiconductor cleaning and CMP applications.
Intersurface Dynamics designs, manufactures, and sells application-specific chemicals for processes used in the production of Silicon, Silicon Carbide, and Sapphire wafers: lenses made of different glass and laser materials; integrated circuits; and display and flat glass.