Pyramax TrueFlat Reflow Oven

Pyramax reflow ovens have a long and successful history in semiconductor packaging applications such as flip chip, curing, reflow and die attach applications. Requirements for end-use devices continue to drive miniaturization while demanding greater semiconductor performance and capability. These requirements can create manufacturing challenges such as substrate warpage and die tilt. BTU’s new TrueFlat Technology addresses these problems by applying a low pressure suction to the bottom of substrate carrier, holding the substrate flat throughout the reflow process. The optional TrueFlat Technology system fits within the existing Pyramax footprint without using expensive vacuum pumps and specialized vacuum transport carriers. Recipe transfer and operation are easy to implement while Pyramax’s legendary thermal performance and process repeatability are maintained.