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Lead Free Solder Wafer Bumping – Oven Control and Solder Material Consistency Are Critical

Lead Free Solder Wafer Bumping – Oven Control and Solder Material Consistency Are Critical

Advanced Packaging – Sept 2004 — A discussion on the transition to lead-free processing for wafer bump reflow with a focus on process control.

  • Date: February 3, 2015
  • Type: application/pdf
  • Size: (150.9 KB)