Advanced Reflow Strategies for Panel-Level Packaging

BTU International, a leading provider of advanced thermal processing equipment, unveiled its latest innovations in wafer bumping reflow technology at the China Semiconductor Executive Assembly Conference (CSEAC) 2025. Thomas Tong, Process Technology Manager at BTU, presented a comprehensive approach to optimizing reflow processes for reliable wafer bumping in Panel-Level Packaging (PLP), a critical step in high-density semiconductor manufacturing.

Tong emphasized the importance of precise thermal profile control to ensure solder quality, minimize warpage, and maintain uniform bump formation. His presentation detailed the selection of convection ovens, profile types, and atmosphere control strategies—including inert and reducing environments—to meet the evolving demands of PLP. With a focus on throughput, uniformity, and repeatability, BTU’s solutions enable manufacturers to achieve consistent performance across global facilities. The session concluded with insights into controlling thermal gradients and localized heating to reduce stress and improve yield.

For more information, visit www.btu.com or contact Thomas Tong at ttong@amtechsystems.com.