Ewing Hsieh talks to Trevor Galbraith of Global SMT & Packaging about BTU’s award wins
Global SMT & Packaging – May 2018 – BTU celebrated three award wins at Nepcon China 2018. The first was for their Pyramax vacuum reflow technology to assist in void reduction. The second was Profile Guardian which continuously montors the temepature in each reflow oven heating zone and the third award was for the Trueflat technology for substrate flatness.
Read MoreBTU Picks Up Three EM Asia Innovation Awards at NEPCON China
NORTH BILLERICA, Mass., April 26, 2018 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announces that it was awarded three 2018 EM Asia Innovation Awards during NEPCON China. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven, TrueFlat technology and Profile Guardian…
Read MoreBTU to Show PYRAMAX and Profile Guardian at NEPCON China
NORTH BILLERICA, Mass., March 30, 2018 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and…
Read MoreBTU to Show the PYRAMAX 125N Dual Lane Reflow Oven at productronica China
NORTH BILLERICA, Mass., February 26, 2018 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at productronica China, scheduled to take place March 16-18, 2018 at the Shanghai New International Expo Centre. The company will showcase the PYRAMAX™ 125N Dual Lane Reflow Oven in Booth…
Read MoreBTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China
NORTH BILLERICA, Mass., February 21, 2018 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre. TrueFlat…
Read MoreBTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan
NORTH BILLERICA, Mass., August 24, 2017 — BTU International, Inc., a leading supplier of advanced thermal processing solutions for the electronics manufacturing market, today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth…
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