The Next Generation of Vacuum Reflow
Aurora Vacuum brings BTU's proven void-reduction technology to the Aurora platform — dual-lane vacuum processing, engineered for the smart factory and built on a legacy of thermal excellence.
Dual-Lane, High Yield Vacuum Reflow
Aurora Vacuum is BTU's next-generation vacuum reflow platform, designed for high-volume manufacturers who need void-free soldering without compromising throughput.
Built on the same dual-lane Aurora architecture that delivers superior thermal uniformity, integrated flux management, and smart energy-saving software, Aurora Vacuum adds a bell-jar vacuum chamber with a soft-start vacuum system that gently ramps pump-down to reduce component shift and defects, in-chamber heating for precise profile accuracy, and a low-vibration transport system built around a titanium-alloy conveyor. The result is a 620 x 711mm (24.4 x 28in) chamber that handles large-format boards and — optionally — two lanes of vacuum throughput at once.
That flexibility matters because single-lane vacuum chambers can become a production bottleneck at scale — as volumes grow and packages get larger, manufacturers are often forced to trade void-free quality for throughput. Aurora Vacuum's dual-lane configuration removes that tradeoff for lines that need it, without compromising the large-format, single-lane capability that's standard on every unit.
Designed for Maintenance Accessibility
The Aurora Vacuum process chamber uses a clamshell design with powered hood lift actuators, giving service techs wide, tool-free access to the full chamber — including the vacuum chamber's own clamshell top access cover — to minimize time to repair.
- Powered hood lift actuators for tool-free access
- Vacuum chamber clamshell top access cover
- Independent, self-contained vacuum chamber transport (center support available as an option)
Two Lanes. One Vacuum Chamber. No Compromise on Voids.
Aurora Vacuum redefines what's possible in vacuum reflow with dual-lane operation inside a single, wider vacuum chamber. Where Pyramax Vacuum processes one lane at a time, Aurora Vacuum can run two boards through vacuum simultaneously — or use the added chamber width to process larger boards that wouldn't fit before. The result: void reduction performance that no longer comes at the cost of throughput.
- Dual-lane vacuum chamber — process two boards per vacuum cycle
- Wider chamber envelope vs. Pyramax Vacuum's 457 x 457mm (18" x 18")
- Built on Aurora's configurable conveyor platform
High-Yield Vacuum Reflow
Aurora Vacuum's throughput and void-reduction gains come from six specific engineering choices, not just a wider chamber:
Soft-Start Vacuum Pump Control
Recipe-adjustable pump-down (25 sec to 20 Torr) prevents the solder-ball splatter and component movement that fast, uncontrolled pump-down can cause — the exact failure mode documented in BTU's own vacuum reflow whitepaper.
In-Chamber Heating Zones for Maximum Profile Control
External forced convection plus an internal top-only radiant panel heater keep the reflow profile precise inside the vacuum chamber itself, not just before it.
Low-Vibration Conveyor & Vacuum System
Reduces component movement and shift during processing, complementing the soft-start pump control above.
Titanium-Alloy Chamber Conveyor
The rail-edge conveyor inside the vacuum chamber is titanium-alloy — chosen for lower weight and lower thermal expansion, the same reason titanium shows up in semiconductor furnaces, wafer processing equipment, and CMP tools where corrosion resistance and dimensional stability matter.
Three Independent Conveyor Sections
Pre-vacuum heating, the vacuum chamber, and cooling each run as self-contained, independent sections — built to maximize throughput rather than waiting on a single continuous belt.
24-Inch Vacuum Chamber — Large Boards or Dual-Lane
Up to 24.4 x 28 in (620 x 711mm) for a single large board, or two 11.2 in lanes side-by-side for dual-lane throughput.
Void-Free, Fluxless Reflow No Post-Solder Cleaning Required
BTU offers fluxless reflow capability using formic acid atmosphere in a flexible configuration, compatible with multiple reflow platforms and recipe controlled dual-process option for inert high-purity nitrogen atmosphere.
Engineered for today's most demanding manufacturing challenges
From delicate ultra-thin substrates to high-mass server boards, Aurora is built to perform across a wide range of advanced electronics and semiconductor assembly applications—delivering exceptional precision, repeatability, and reliability where it matters most.
SMT Reflow
Run high-volume SMT lines with consistent throughput, superior zone control, and optional dual-lane configurations.
High-Mix Manufacturing
Adapt quickly to different board types and products with configurable zone layouts, conveyor options, and flexible automation.
Power Electronics & Automotive
Support high-mass, high-reliability assemblies with excellent thermal uniformity and void-reducing process capabilities.
Vacuum Reflow: Eliminating Voids at the Source
Solder voids form during reflow from paste solvent and solids volatilization, oxide volatilization, and outgassing from the PCB or component. Left in place, voids in thermal pads and power packages block heat transfer and reduce reliability — a particular concern for QFN, MLF, and other thermally-critical devices.
Aurora Vacuum is designed to reduce voiding to <5% (process dependent) — and in BTU's own lab trials, often goes well beyond that.
Key benefits:
- Reduces solder voids to <5% in thermal pads and power packages
- Improves heat dissipation and long-term reliability
- Backed by BTU's own Advanced Process Lab data, not just claims
- Recipe-controlled — repeatable, not a manual add-on step
Vacuum reflow addresses this directly: applying a controlled vacuum to the molten solder joint pulls entrapped gas out before the joint solidifies. BTU's own trials at the Universal Instruments Advanced Process Lab, run across more than 200 boards with multiple pastes, board finishes, and pad designs, found:
- Void levels dropped from ~20–39% at atmospheric pressure to under 2% in MLF100 packages at a hard vacuum of 20 Torr with a 30-second hold time.
- Even a soft vacuum (245 Torr) and a short 5-second hold removed a meaningful share of voids.
- Smaller components are easier to de-void than larger ones — a key reason vacuum reflow is especially valuable for large thermal pads and power packages.
Full data is available in BTU's whitepaper, "Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data."
BTU's Process Expertise: Optimized, Not Just Maximized
- BTU's process studies identify the optimal vacuum level for each application — not simply the deepest setting available
- Avoids unnecessary pump-down time, enabling faster cycle times without sacrificing void reduction
- Supports Aurora Vacuum's soft-start approach for further defect reduction
- Delivers optimized yield and productivity together — backed by verified process data, not guesswork
Aurora Vacuum Reflow Oven Key Features & Innovations
Dual-Lane Vacuum Processing
Run two boards per vacuum cycle, or process wider boards, in a single chamber — doubling vacuum throughput versus single-lane systems.
Bell Jar Vacuum Chamber Design
The same proven chamber mechanism as Pyramax Vacuum, sized wider for Aurora Vacuum's dual-lane operation, for reliable vacuum sealing and trouble-free operation.
Recipe-Controlled Vacuum Parameters
Vacuum level, hold time, pump-down, and equalization are all recipe-driven and repeatable — carried over from Pyramax Vacuum's proven process control.
Superior Thermal Uniformity
Closed-loop convection control with side-to-side recirculation delivers consistent, high-precision thermal performance across every board. Repeatable results—system to system, site to site—reduce zone temperature set-points for unmatched efficiency.
Configurable Heating and Cooling Zones
Aurora is the first reflow oven with factory-configurable heat and cooling zones. Tailor your system to handle heavy boards, slow cooling needs, or high-throughput lines—convert zones in two-zone increments.
Available as an option (alongside a condensation exchanger system), this fully automatic, water-based system continuously removes flux contaminants from the oven atmosphere—reducing maintenance and keeping performance consistent regardless of flux type.
Wincon delivers modern thermal control with a SEMI E95-style UI, light/dark mode, and full MES integration. Real-time diagnostics, barcode traceability, and custom alerts give operators total visibility.
An integrated, redundant process monitor that tracks actual board-level performance versus recipe baselines. Enables full traceability when paired with barcode readers and supports MES data capture.
Smart Power
BTU’s exclusive Smart Power software reduces peak power draw, allowing for a lower connected load and faster response times. Automatically adjusts within a defined limit to optimize performance.
This intelligent energy-saving feature reduced energy consumption during production gaps by intelligently adjusting oven performance—then rapidly recovers to maintain profile integrity.
Standard Features
Aurora Vacuum ships standard with:
Global Support, Industry-Leading Warranty
BTU reflow ovens and furnaces are backed by BTU’s global network of 24/7 service and technical support in over 50 countries. We stand behind our systems with the industry's best warranty:
- Lifetime on heaters and blowers
- 3 years on system components
- 1 year on labor
- BTU Production and Engineering Facilities
- BTU Regional Locations
- BTU Representatives
- 24/7 Worldwide Customer Support
- Manufacturing and Engineering in the US and China
- Process Applications Laboratories in the US and China
- Multiple Global training locations
Ready to improve yield, reduce downtime, and optimize your reflow process? Aurora is ready when you are.
Let’s talk about how Aurora can increase yield and reduce downtime in your facility.
Purpose-built for thermal processes since 1988, WINCON™ delivers unmatched reliability, data accuracy, and system control with thousands of proven installations worldwide.
WINCON 8 features next-generation control with animated dashboards, SmartPower management, Energy Pilot cost savings, and RecipePro recipe generation. Fully Industry 4.0 ready with comprehensive connectivity through CFX, Hermes, OPC, REST, and MQTT protocols—enabling seamless MES integration, barcode support, and real-time traceability without proprietary middleware.
Aurora Vacuum Reflow Oven Specifications
| Feature | AURORA 125N50-VAC28 |
|---|---|
| Atmosphere | nitrogen / air |
| Temperature Ratings | Process Chamber: 350°C; Vacuum Chamber: 300°C |
| Convection Heated Zones | 10 top and bottom |
| Vacuum Chamber Internal | 2 top radiant panel zones |
| Vacuum Chamber Heat Assist | 3 heated convection zones |
| Conveyor System | edge rail support |
| Vacuum Chamber Zones | 1 zone |
| Vacuum Chamber Size | 620.0 x 711.0 mm (24.4 in. x 28.0 in.) |
| Conveyor Width — Single Lane | 2–24.4 in (50.4–620 mm) |
| Conveyor Width — Dual Lane | 2–11.2 in per lane (50.4–284.5 mm) |
| Vacuum Level | 20 Torr (5 Torr optional) |
| Pump Down Time | 15–20 seconds (typical) |
| Hold Time | 10–60 seconds |
| Refill Time | 2–4 seconds (typical) |
| Vacuum Seal | O-ring (bell jar design) |
| Total System Width | 75 in (1905 mm); 138.8 in (3525 mm) w/ vacuum pump |
| Total System Length | 285.63 in (7255 mm) |
BTU is committed to helping manufacturers achieve their production and sustainability goals. By optimizing energy use, minimizing waste, and reducing downtime, our technologies support a lower total cost of ownership and a smaller environmental footprint.
From global OEMs to local contract manufacturers, BTU customers are leveraging these innovations to reduce costs and meet corporate sustainability targets. In many cases, budget is already allocated for energy and environmental improvements—making upgrades both good business and good citizenship.
Whether you're trying to improve your bottom line—or meet aggressive ESG targets—BTU’s platform of smart features makes it easy to do both.
Reduce running costs and energy waste.
Our EnergyPilot software automatically lowers power and process gas consumption during production gaps—cutting operating costs while maintaining peak performance. It’s an easy way to improve sustainability without sacrificing throughput.
Lower peak energy demand. Run smarter.
Smart Power dynamically limits your oven’s total power draw, reducing the connected load and helping you meet facility-level energy caps. It enables faster start-up and response—even when operating under power restrictions.
Efficient flux management with less waste.
Aqua Scrub neutralizes flux residue using a closed-loop, aqueous-based system—reducing emissions and maintenance while extending uptime. It supports a cleaner process with lower water usage and fewer disposables.
Reflow Oven Resources
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