Advanced Reflow for Heavy Boards

Unmatched Thermal Control for Complex SMT Boards

Global Leader in Advanced Reflow for Heavy Boards

BTU International’s Pyramax and Aurora reflow ovens are engineered to meet the demanding requirements of heavy PCB assemblies in surface mount technology (SMT) reflow processing. Whether you're working with high thermal mass boards or complex multilayer designs, our ovens deliver precision, power, and performance—without compromise.

Any Board, Anytime, Anywhere

Heavy PCBs require more than just more heat—they demand more from the entire system. BTU’s reflow ovens are designed with a holistic thermal architecture that ensures consistent, repeatable results across a wide range of board types and production environments. 

Built for Demanding Applications

Whether you're in automotive, aerospace, or industrial electronics, BTU’s reflow ovens are built to handle the thermal challenges of heavy PCBs: 

  • Wide Process Window:

    Supports a broad range of solder profiles and board types.

  • Exceptional Thermal Uniformity:

    These heavy boards are extremely valuable, often for data center, communications or other applications. Tight process control will maximize yield.

  • Scalable Configurations:

    From lab-scale to high-throughput production, Pyramax and Aurora offer flexible solutions.  The Aurora 200N is the largest reflow oven manufactured by BTU and is well suited to more demanding thermal requirements – and can be configured with more cooling to maintain low exit temperature.

  • Low Maintenance and High Reliability:

    BTU offers the most advanced flux management system, the AquaScrub, which keeps the oven clean even for high-volume, heavy board applications.

Thermal Performance That Goes Beyond the Surface

  • High Heater Power:

    Robust heating elements deliver the energy needed to penetrate dense board structures.  BTU configures high powered heaters to deliver power to the zones where it is most needed for the thermal profile.

  • Closed-Loop Convection Control:

    BTU reflow ovens maximize heat transfer through the highest convection rates in the industry

  • Intellimax™ Control with Proprietary PID Algorithms:

    Advanced process control ensures tight thermal regulation, adapting in real-time to board characteristics.

  • Conveyor Systems Enhanced for Robustness and Reliability:

    For customer applications where the board loading exceeds 6kg/linear meter (or square meter) BTU recommends the use of a heavy loading railThese rails are purpose designed to handle high-volumes of massive boards while minimizing rail wear and conveyor failures.

  • High Performance Cooling Systems:

    The Pyramax and Aurora reflow ovens are known for their superior exit temperatures with cooling systems featuring closed- loop convection controlIn addition the Aurora has configurable heating and cooling zones – allowing customers to add more cooling zones to further enhance cooling capability.

Ask us questions on any products or to learn more about the latest advancements in reflow ovens, WINCON control updates or SMT technology. 

Schedule a demo

  • This field is for validation purposes and should be left unchanged.
  • Note: Not all equipment is available at each location. Equipment needs may dictate the location.