LED Packaging & Assembly
LEDs (Light Emitting Diodes) are having a significant impact on the lighting industry. This is driven by technology, cost of ownership pressure, energy savings, and elimination of toxic waste. Currently the life cycles of new designs can be as short as 6 months due to rapid change cycles.
BTU’s thermal processing technology can be used in a number of areas in LED manufacturing.
LED assembly techniques include solder reflow and die attach. BTU’s Pyramax reflow oven is optimized for LED manufacturing with large board capability and closed-loop convection process control. Pyramax leverages more than a decade of semiconductor packaging and SMT assembly experience. For very large LED boards Pyramax features 24″ process width. The 12 zone, Pyramax 150z12, configuration is suggested to optimize throughput and thermal uniformity for the largest LED boards.
Silver Sintering, a low temperature sintering process with an integrated binder burnout, is being employed for LED packaging. The profile peaks at 250°C with a 1 hour hold time, plus ramp and binder burnout – total process time is approximately 2 hours. BTU has both custom radiant furnaces and configurable inline convection systems configurable meet the process requirements of Silver Sintering.
Direct Bond Copper
Direct Bond Copper is the direct mating of two dissimilar electronic materials (Copper and Ceramic). DBC is an advanced technique for heat dissipation for packaging of high-powered LEDs. The interface between the pure copper and the ceramic is very reliable. The DBC process takes advantage of the copper – oxygen eutectic where the melting point is lower than that of pure copper or oxide ceramic. At the melting temperature the eutectic is the only liquid present, it wets and bonds to both surfaces. BTU Controlled Atmosphere Muffle Furnaces (TCA) are optimized for DBC processing. The furnaces are fully customizable to meet varying process/production requirements including very low O2 levels.
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Controlled Atmosphere Furnaces