Peter Franklin from BTU on the Expanding Aurora Platform with Global SMT TV
Trevor Galbraith of Global SMT TV caught up with Peter Franklin of BTU International on the show floor. Peter introduces the Aurora 125, the newest and most compact model in BTU’s Aurora reflow platform, which retains the line’s integrated Aqua Scrub flux management system, a gas-wash design built into the oven frame for greater efficiency. He also describes the new Aurora Vacuum, which reduces solder-joint voiding in automotive and large-device applications.
The conversation turns to a changing market, from growing semiconductor packaging demand, especially in Taiwan, to rising defense spending across Europe as automotive declines. Peter also highlights BTU’s TrueFlat technology for maintaining wafer flatness in bumping.
Bob Bouchard from BTU Talks Data Center Reflow with Global SMT TV
Keith Bryant of Global SMT TV sat down with Bob Bouchard of BTU International to discuss BTU’s latest reflow technology. Bob covers two September 2026 launches: the Aurora Vacuum reflow system, with an expanded chamber for large, heavy AI-level boards, and a field-upgradeable formic acid capability that uses less acid. He also walks through the Aurora 200N, with up to 16 heated zones, and explains how data center customers use its later zones to tightly control slow cooling rates for large BGAs.
Watch the interview to see how zones can be reconfigured and how the conveyors have been strengthened for heavy boards.
BTU International to Showcase High-Reliability Reflow Solutions at SMTA Space Coast
WESTFORD, Mass., October 19, 2026 – BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor packaging markets, will showcase its high-reliability reflow solutions at the SMTA Space Coast Expo and Technical Forum, taking place November 11 at the Melbourne Auditorium in Melbourne, Florida. The company will highlight its…
Read MoreEFX 2026: Peter Franklin from BTU with What’s New in Electronics
What’s New in Electronics caught up with Peter Franklin of BTU International at EFX 2026. BTU brought the Aurora 125, the smallest machine in its Aurora platform, and is launching the Aurora Vacuum platform, which builds on the vacuum oven in its Pyramax range. The larger vacuum chamber can be used for dual-track processing or very large PCBs. Peter explains the growing interest in vacuum soldering, particularly in automotive and defense, where solder joint reliability is critical in high-power applications.
He also shares a strong picture of the year, with a big uptick in Asia in semiconductor packaging and wafer bumping, and increasing demand for high-temperature applications such as glass-to-metal sealing for military-standard connectors.
BTU International Wins 2026 Mexico Technology Award for Aurora Vacuum™ Reflow Innovation
WESTFORD, Mass., October 8, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced that its Aurora Vacuum™ Reflow Oven received a 2026 Mexico Technology Award in the Reflow category. The award was presented during a ceremony held before SMTA Guadalajara 2026 on Wednesday, October 7, 2026, in Guadalajara, Jalisco,…
Read MoreBTU International Showcases Aurora™ Reflow Solutions for Large AI Server Boards and High-Throughput Vacuum Processing at SMTA Guadalajara
WESTFORD, Mass., September 1, 2026 –BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor packaging markets will exhibit at SMTA Guadalajara 2026, taking place October 7-8th in Guadalajara, Mexico. Attendees can visit BTU at Booth 745 at Expo Guadalajara, where the company will showcase its latest Aurora reflow technology tailored for heavy boards and high-yield applications. Highlighted in the booth will…
Read MoreBTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing
WESTFORD, Mass., August 24, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies. As AI infrastructure, automotive electronics, advanced packaging, and…
Read MoreBTU Introduces High-Yield Reflow Technologies for Advanced Packaging at SEMICON Taiwan
WESTFORD, Mass., August 26, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, will showcase its latest high-yield reflow technologies at SEMICON Taiwan in Booth I2516, with a focus on advanced packaging and other high-density applications. BTU’s booth is collocated with trusted representative, CohPros International. Visitors will have the…
Read MoreBTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging
WESTFORD, Mass., August 21, 2026 –BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, today announced the availability of an advanced Formic Acid Reflow capability across multiple reflow oven platforms. Designed to support the increasing demands of advanced semiconductor packaging, power devices, and high-reliability electronic assemblies, the new process option enables fluxless soldering while…
Read MoreBTU International Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region
WESTFORD, Mass., April 6, 2026 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026. Under the agreement, PTG will…
Read More