我们制造世界上性能最好的回流焊炉和连续带式炉 用于精密大批量制造

面板级封装正在重塑先进半导体制造的经济模式——但这对回流焊工艺提出了极高的要求。对于尺寸最大达700毫米×700毫米的面板，必须确保整个基板上的温度分布均匀；而不同材料之间的热膨胀系数（CTE）不匹配，则会带来翘曲和热应力的风险。

BTU's Pyramax and Aurora reflow ovens are purpose-configured to meet these requirements — delivering <4°C thermal uniformity across the full panel width, single-digit ppm O₂ atmosphere control, programmable heating and cooling rates, and optional TrueFlat™ warpage elimination for ultra-thin substrates. Closed-loop convection control enables oven-to-oven repeatability, so a single recipe runs reliably across multiple systems worldwide.