Improving Reflow wSPC Part II
Circuits Assembly – Jan 2002 — This is the second article in the three-part seiries on using SPC in the reflow process. This article describes the types of SPC tools that can be used to better understand the relationship between processing steps and how SPC, properly implemented, can track quality, monitor process deviations and increase…
Read MoreImproving Reflow w/SPC Part III
Circuits Assembly – Feb 2002 — The final part of the three-part series on using SPC to improve the reflow process.
Read MoreEnhanced Atmosphere Separation and Closed Loop Oxygen Control for BME MLCC Sintering
Capacitor and Resistor Technology Symposium (CARTS) – Mar 2001 — This paper discusses a new method available for achieving atmosphere convection, separation and closed loop Oxygen control in a BME MLCC Pusher Furnace.
Read MoreGlass to Metal Sealing by a Single-Atmosphere, Single Firing Process
The International Journal for Hybrid Microelectronics – July 1988 — A process is described whereby strong and hermetic matched seals can be fabricated in a single furnace pass.
Read MoreMaking A Case for Continuous Furnaces
Industrial Heating Magazine – Sept 2002 — A continuous furnace is ideal for processes requiring high production volumes, process consistency,and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace.
Read MoreCircuits Assembly Dimock Repeatability
SMT Reflow — Oven to Oven Repeatability: How to adjust an oven so a single recipe will work across multiple ovens for an individual product.
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