Photovoltaics International – Nov 2009 — A paper by David Jimenez of Wright Williams & Kelly, Inc., uses a standarized cost of ownership analysis to compare in-line diffusion with batch processing.

SECAP – 2005 — A collection of papers on wafer level packaging and flip chip bumping covering a range of topics including plating, UBM, photolithography, and lead-free processing. As a member of SECAP, BTU contributed a paper on Next Generation Wafer Bump Reflow Processing.

Reprinted from Global SMT & Packaging Magazine – Jan 2004 — The effects of convection rate on process repeatability, peak temperature and thermal uniformity are investigated.

Circuits Assembly – July 2004 — The transition to lead-free processing is discussed including the lead-free process impact and whether a new reflow oven is required.

SMT Magazine – Aug 2004 — Part of SMT Magazine’s “step by step” series. The “Step 7” article covers soldering including a discussion on lead-free processing.

Advanced Packaging – Sept 2004 — A discussion on the transition to lead-free processing for wafer bump reflow with a focus on process control.

Global SMT & Packaging – Oct 2004 — A discussion on the oven requirements for lead free solder. This article discusses issues like oven length, thermal capacity, speed, zones, flux management, board support mechanisms, the use of nitrogen, and convection control.

Circuits Assembly – Dec 2001 — First of a three-part series on using SPC to improve the reflow process. In this article analytical tools are used to determine how all oven parameters are operating at the time an optimum oven profile is established.