Advanced Reflow Strategies for Panel-Level Packaging
BTU International, a leading provider of advanced thermal processing equipment, unveiled its latest innovations in wafer bumping reflow technology at the China Semiconductor Executive Assembly Conference (CSEAC) 2025. Thomas Tong, Process Technology Manager at BTU, presented a comprehensive approach to optimizing reflow processes for reliable wafer bumping in Panel-Level Packaging (PLP), a critical step in…
Read MoreMaintaining Oven Performance while Reducing the Cost of Reflow
Reflow ovens are among the largest energy consumers in the SMT process, with nearly half of their operating time spent in non-processing modes such as setup, idle, and hold. While operators may lower set points or power down ovens during downtime, this requires manual intervention and risks delays. To address the issue, a software tool…
Read MorePractical Thermal Profile Expectations in a Dual-Lane, Dual-Speed, Reflow Oven
Dual-lane reflow ovens have been available for years, permitting two boards to be run at the same time in parallel. Until recently, circuit board manufacturers have been limited to processing the same boards or boards with like mass in each of the lanes, but dual-lane reflow ovens with independent lane speeds now make it possible…
Read MoreSMT Reflow Oven-to-Oven Repeatability
In this article Fred Dimock, BTU’s Manager Process Technology, explains oven-to-oven repeatability across multiple SMT reflow oven process lines using a single process recipe. learn more about how to quickly set-up and run a product on different process lines This article focuses on helping the process engineer run a single recipe on multiple ovens of…
Read MoreReducing CTE Mismatch Defects in Flip Chip Reflow
US Tech – May 2019 – In this article Thomas Tong and co-authors explain the use of the TrueFlat reflow oven technology to keep very thin substrates flat during reflow. This is an important consideration for flip chip processes where CTE mismatch is an inherent process challenge. Learn more about substrate flatness during reflow This…
Read MoreOperation of a Vacuum Reflow Oven
In this presentation BTU’s Fred Dimock explains the operation and configuration of an inline vacuum reflow oven. Included in this presentation is the preliminary voiding data generated when the Pyramax Vacuum reflow oven was at Universal’s Advanced Process lab. Learn more about vacuum reflow Vacuum reflow, the science of using nothing to remove empty spaces…
Read MoreThermal Processing Expertise Reaches Across Industry Boundaries
USTech – July 2018 – Michael Skinner of USTech visted BTU’s USA Headquarters, where custom belt furnaces have been manufactured for nearly 70 years. The article covers BTU’s capabilities for high temperature, controlled atmosphere processing as well as BTU’s history in the reflow oven industry. Decades of Thermal Processing Expertise The ability to carefully control…
Read MoreReducing Reflow Costs in a Challenging Economy
Presented at SMTA San Diego – Sept 2013 — In this presentation, Fred Dimock, Manager Process Technology, discusses 10 methods that can be used to reduce the cost of operating a reflow oven Attacking the Real Costs of the Reflow Oven The initial purchase prices of a reflow oven is small fraction of the overall…
Read MoreThermal Profiles – Why Getting Them Right is Important
Presented at ACI Technologies – Dec 2011 — In this presentation, Fred Dimock, Manager Process Technology, gives a comprehensive overview of thermal profiling including: recipes vs. profiles, material properties, TC acccuracy, profilers and test vehicles, process window, heat transfer and oven control.
Read MoreFlux Removal Method for Reflow Furnaces
SMTAI – 2020 – Described in this work, is a novel method of capture which separates flux from the recirculating furnace gas using an aqueous gas/liquid sequestration process. This system operates automatically and does not require production line shut-down for routine maintenance which consists of periodically emptying a small liquid waste container. This method is…
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