Reflow Ovens

Solder reflow ovens for printed circuit board assembly and semiconductor packaging

BTU is a leading supplier of convection reflow ovens used in electronics assembly and advanced packaging applications — including 2.5D and 3D technologies used in AI chip packaging

BTU’s reflow ovens, both the Aurora and Pyramax product lines, are recognized globally as performance leaders for the most demanding thermal applications.

BTU’s reflow ovens deliver industry-leading thermal performance for SMT and advanced packaging. From ultra-thin substrates to heavy server boards, our solutions offer unmatched process control, repeatability, and total cost-of-ownership advantages for high-volume manufacturers.

Trusted by electronics, automotive, and semiconductor manufacturers worldwide.

BetterUniformitySpeedControlRepeatability

Pyramax and Aurora reflow ovens beat the competition in thermal uniformity, repeatability and exit temperature - even at higher throughput.

In printed circuit board assembly, surface mount technology SMT reflow is performed by Pyramax and Aurora convection reflow ovens — known worldwide as the performance leaders. With closed loop convection control the Pyramax and Aurora reflow ovens offer the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line. For semiconductor packaging, BTU offers nitrogen processing using the Pyramax and Aurora convection reflow ovens with astounding atmosphere purity with O2 levels as low as 2ppm above source in the peak zones.

Apples to Apples, BTU Delivers More

Watch how BTU’s reflow performance outpaces the competition—on speed, temperature control, and thermal uniformity. In this real-world test, both systems run the same profile at the same speed. BTU exits cooler, cleaner, and more consistent.

Then we push it further: 30% faster—and BTU still outperforms.

✅  Faster throughput
✅  Superior thermal control
✅  Cooler board exit temps
✅  Higher yield, more productivity

Watch the Comparison

When everything is riding on your reflow oven, BTU finishes strong.

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Reflow in a new light

Aurora Reflow Oven

Aurora is BTU’s next-generation reflow oven, engineered for precision, flexibility, and performance in advanced packaging and high-density applications—including thin substrates and heavy board assemblies.

Unmatched Performance

Pyramax Reflow Oven

BTU’s Pyramax reflow ovens set the standard for high-throughput, precision thermal processing in SMT and advanced packaging, delivering unmatched thermal performance, versatility, and value with closed-loop control trusted by manufacturers worldwide.

Leader for ultra-thin substrates

Pyramax TrueFlat Reflow Oven

Eliminate Warpage. Reduce Voids. Improve Yield.
The Pyramax TrueFlat reflow oven is the industry-leading solution for ultra-thin substrates, delivering unmatched flatness control to eliminate warpage and die tilt—outperforming conventional reflow ovens in advanced packaging applications.

High-volume + Void reduction

Pyramax Vacuum Reflow Oven

Pyramax Vacuum delivers high-performance, high-volume reflow soldering with advanced void reduction technology—ideal for power semiconductors, automotive electronics, and other demanding packaging applications.

High-mix + High-volume

Pyramax ZeroTurn Dual Chamber Reflow Oven

The Pyramax ZeroTurn Dual Chamber reflow oven enables rapid recipe switching and unmatched throughput with its dual-lane, dual-chamber design—ideal for high-mix, high-volume production environments.

Reduce emissions & operating costs

Aquascrub Flux Management

AquaScrub is BTU’s eco-friendly, closed-loop flux management system that reduces emissions and operating costs while maximizing uptime and extending maintenance intervals.

Optimized for Your Application

No matter your process or production challenges, BTU reflow ovens are engineered to deliver peak performance in a wide range of demanding environments. From delicate ultra-thin substrates to high-mass server boards, our solutions are tailored to your application.

Silicon wafers

Achieve flatness, eliminate warpage, and reduce die tilt. TrueFlat™ is purpose-built for advanced packaging lines handling ultra-thin substrates where planarity is critical to yield.

reflow for heavy boards

Any Board, Anytime, Anywhere — BTU Aurora and Pyramax ovens handle thick, high-mass PCBs with precision. Optimized convection and configurable options ensure consistent, reliable reflow for heavy server and power boards.

vac-pic with void

When voiding is not an option, the Pyramax Vacuum delivers. Ideal for power semiconductors and automotive electronics, it combines high-volume performance with advanced void-reduction capability.

Dual Chamber Reflow Oven

Switch recipes instantly with he ZeroTurn dual-lane, dual-chamber reflow designed for high-mix environments. Minimize downtime, boost throughput, and run with ultimate flexibility.

Compare Models

BTU’s ovens and furnaces are the industry's process and productivity leaders and have over ten thousand installations.

Feature / Model Aurora Pyramax Pyramax Vacuum Pyramax TrueFlat Pyramax ZeroTurn
Thermal Performance ★★★★★ ★★★★★ ★★★★★ ★★★★★ ★★★★★
High-Volume Production
Void Reduction ✅ Vacuum Chamber
Ultra-Thin Substrates ✅ TrueFlat Technology
Heavy Board Capability
Dual Lane / Dual Chamber ✅ Instant Recipe Switching
Best for SMT
Best for Advanced Packaging
Energy Efficiency EnergyPilot™
SmartPower™
EnergyPilot™
SmartPower™
EnergyPilot™
SmartPower™
EnergyPilot™
SmartPower™
EnergyPilot™
SmartPower™
Unique Features Advanced design & UI
Configurable Heating & Cooling
Proven reliability Vacuum void reduction Warpage elimination High-mix flexibility
Environmental Friendliness AquaScrub Flux Management AquaScrub Flux Management AquaScrub Flux Management AquaScrub Flux Management AquaScrub Flux Management

Find the Right Oven for Your Process

Find the Right Fit

How many zones do I need? How long should it be?
Use our configurator to determine the optimal reflow oven based on your product size and throughput.

Schedule a Live Demo

See Pyramax or Aurora in action.
Get a walkthrough of the features and options that matter to your process.

Talk to a Thermal Expert

Not sure where to begin?
We’ll help you choose the right reflow oven for your application and goals.

Sustainability Backed by ROI Minimize cost.
Maximize uptime.
Reduce environmental impact.

BTU is committed to helping manufacturers achieve their production and sustainability goals. By optimizing energy use, minimizing waste, and reducing downtime, our technologies support a lower total cost of ownership and a smaller environmental footprint.

From global OEMs to local contract manufacturers, BTU customers are leveraging these innovations to reduce costs and meet corporate sustainability targets. In many cases, budget is already allocated for energy and environmental improvements—making upgrades both good business and good citizenship.

Whether you're trying to improve your bottom line—or meet aggressive ESG targets—BTU’s platform of smart features makes it easy to do both.

Reduce running costs and energy waste.

Our EnergyPilot software automatically lowers power and process gas consumption during production gaps—cutting operating costs while maintaining peak performance. It’s an easy way to improve sustainability without sacrificing throughput.

Lower peak energy demand. Run smarter.

Smart Power dynamically limits your oven’s total power draw, reducing the connected load and helping you meet facility-level energy caps. It enables faster start-up and response—even when operating under power restrictions.

Efficient flux management with less waste.

Aqua Scrub neutralizes flux residue using a closed-loop, aqueous-based system—reducing emissions and maintenance while extending uptime. It supports a cleaner process with lower water usage and fewer disposables.

Schedule a demo

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