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PRINTED CIRCUIT BOARD ASSEMBLY AND
SEMICONDUCTOR PACKAGING

BTU is the global leader in thermal process equipment used for the production of electronics andPmax100A electronic components. Typically these applications require high productivity and excellent process control. BTU’s convection reflow ovens are used for printed circuit board assembly, semiconductor packaging, and LED assembly among other applications.

In printed circuit board assembly, surface mount technology SMT reflow is performed by BTU’s Pyramax convection reflow oven. The Pyramax  is known worldwide as the performance leader.   With closed loop convection control the Pyramax reflow oven offers the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line.    For semiconductor packaging, BTU offers nitrogen processing using the Pyramax™ convection reflow oven with astounding atmosphere purity with O2 levels as low as 2ppm above source in the peak zones.

BTU’s systems are the industry’s process and productivity leaders and have thousands of installations. Contact BTU with any questions or to learn about the latest advancements in reflow ovens, furnaces or SMT technology.

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