Reflow Ovens For Electronics Assembly

Printed Circuit Board Assembly and
Semiconductor Packaging

BTU is the global leader in thermal process equipment used for the production of electronics and electronic components. Typically these applications require high productivity and excellent process control. BTU’s reflw ovens and furnaces have been used for printed circuit board assembly, semiconductor packaging, and thick film processing.

In printed circuit board assembly, surface mount technology SMT reflow is performed by BTU’s Pyramax™ and Dynamo reflow ovens. Dynamo is an innovative reflow oven that maximizes thermal repeatability and value for consumer electronics manufacturers.   For semiconductor packaging, BTU offers nitrogen processing using the Pyramax™ convection reflow oven and flux-free hydrogen processing using a controlled atmosphere reflow furnace for applications such as wafer bump reflow. 

BTU’s systems are known worldwide as process and productivity leaders and have thousands of installations. Contact BTU with any questions or to learn about the latest advancements in reflow ovens, furnaces or SMT technology.

Reflow Ovens for Electronic Circut Board AssembliesBTU Reflow Ovens

 

In The News

BTU International’s DYNAMO™ Collects its Third Industry Award during NEPCON China 

BTU Lowers Operating Costs with ENERGY PILOT 

BTU International Receives Seven Unit Order for the DYNAMO 

BTU International Picks Up Another Award for the DYNAMO during Productronica  

 

Papers & Articles

 SMT Oven-to-Oven Repeatability

Experiences in Transferring Recipes from an Eight-Zone Reflow Oven

Oven Adjustment Effects on a Solder Reflow Profile