Reflow Ovens For Electronics AssemblyPrinted Circuit Board Assembly and Semiconductor Packaging BTU is the global leader in thermal process equipment used for the production of electronics and electronic components. Typically these applications require high productivity and excellent process control. BTU’s conveyor ovens and furnaces have been used for printed circuit board assembly, semiconductor packaging, and thick film processing. In printed circuit board assembly, SMT reflow is performed by BTU’s Pyramax™ reflow oven. For semiconductor packaging, BTU offers nitrogen processing using Pyramax™ and flux-free hydrogen processing using a controlled atmosphere furnace for applications such as wafer bump reflow. BTU’s systems are known worldwide as process and productivity leaders and have thousands of installations.  
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