APPLICATIONS

Put Our Thermal Processing Experts to Work for You

BTU’s team of experts has been working for decades to solve critical process problems for a multitude of thermal processes where precision control of temperature and atmosphere are critical to production yield.

BTU’s custom belt furnaces can reach maximum temperatures up to 1800˚C and various process atmospheres including Nitrogen, Hydrogen and Argon. The ability to customize each platform and the wide range of options available make BTU’s belt furnaces a superior fit for a number of applications.

BTU Thermal Processing Experts

Optimized for Your Application

No matter your process or production challenges, BTU reflow ovens are engineered to deliver peak performance in a wide range of demanding environments. From delicate ultra-thin substrates to high-mass server boards, our solutions are tailored to your application.

High temperature furnace applications include:

  • LTCC
  • Advanced Ceramics
  • Solar Cell
  • Powder Processing
  • Curing
  • Drying

BTU delivers proven thermal performance across the world’s most demanding electronics and packaging applications—from heavy boards to ultra-thin substrates and beyond.

Silicon wafers

Achieve flatness, eliminate warpage, and reduce die tilt. TrueFlat™ is purpose-built for advanced packaging lines handling ultra-thin substrates where planarity is critical to yield.

reflow for heavy boards

Any Board, Anytime, Anywhere — BTU Aurora and Pyramax ovens handle thick, high-mass PCBs with precision. Optimized convection and configurable options ensure consistent, reliable reflow for heavy server and power boards.

vac-pic with void

When voiding is not an option, the Pyramax Vacuum delivers. Ideal for power semiconductors and automotive electronics, it combines high-volume performance with advanced void-reduction capability.

Dual Chamber Reflow Oven

Switch recipes instantly with he ZeroTurn dual-lane, dual-chamber reflow designed for high-mix environments. Minimize downtime, boost throughput, and run with ultimate flexibility.

Direct bond copper

BTU is the global leader in controlled atmosphere furnaces for DBC production—delivering unmatched thermal uniformity and atmosphere control for strong, reliable copper-to-ceramic bonding.

2.5D advanced packaging for AI chips

Our reflow ovens are the market leader for 2.5D advanced packaging applications used in the production of AI chips

Applications Support Process Development

BTU maintains advanced demonstration and process development labs in two key global locations: near Boston, Massachusetts, USA, and in Shanghai, China. These facilities are available to support both customer demonstrations and collaborative process development

In addition, BTU offers three more demonstration sites across North America:

These locations provide convenient access for regional customers and partners, ensuring hands-on support and innovation wherever it's needed.

Schedule a demo

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  • Note: Not all equipment is available at each location. Equipment needs may dictate the location.