Knowledge Center

  • All
  • Articles & Whitepapers
  • Product Brochures & Datasheets
  • Technical Bulletins
  • Upgrades

Advanced Reflow Strategies for Panel-Level Packaging

BTU International, a leading provider of advanced thermal processing equipment, unveiled its latest innovations in wafer bumping reflow technology at the China Semiconductor Executive Assembly ...
Aqua Scrub brochure cover

Aqua Scrub Flux Management

Learn more about BTU's Aqua Scrub Flux Management technology. This unique system employs a non-toxic, water-based rinse agent to clean flux from reflow oven process ...
Aurora reflow oven brochure cover

Aurora Reflow Oven

REFLOW IN A NEW LIGHT — Aurora is leading the way to the factory of the future by seeing reflow in a new light. Aurora, ...

Blower Fail Detection Upgrade

Provides real-time monitoring of convection to reduce yield loss. This is accomplished by monitoring the zone static pressure with a differential pressure switch. If a ...
circuits assembly cover

Circuits Assembly Dimock Repeatability

SMT Reflow — Oven to Oven Repeatability:  How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

Closed Loop Convection Upgrade

This upgrade provides closed loop convection rate adjustment via the WINCON™ operating software. This is accomplished by monitoring the static pressure in the heating and ...

Controlled Atmosphere Furnace

Designed for today’s most demanding materials applications, BTU’s muffle furnaces meet the processing needs of glass to metal sealing, stainless steel brazing as well as ...

Cooler Flux Filter Upgrade

Reduces cooler maintenance frequency by trapping solid flux residues. Some flux chemistries create excessive build-up of solids on the cold heat exchangers in the cooler. ...
cost of ownership article cover

Cost of ownership and overall equipment efficiency

Photovoltaics International - Nov 2009 --- A paper by David Jimenez of Wright Williams & Kelly, Inc., uses a standarized cost of ownership analysis to ...
effect of high temp requirements cover

Effect of High-Temperature Requirements for Lead-Free Solder

Circuits Assembly - July 2004 --- The transition to lead-free processing is discussed including the lead-free process impact and whether a new reflow oven is ...
energy pilot brochure cover

Energy Pilot

BTU’s Energy Pilot software enables tremendous energy savings by dynamically adjusting oven settings during gaps in production. BTU’s superior thermal control allows for quick recovery ...
enhanced atmosphere separation article cover

Enhanced Atmosphere Separation and Closed Loop Oxygen Control for BME MLCC Sintering

Capacitor and Resistor Technology Symposium (CARTS) - Mar 2001 --- This paper discusses a new method available for achieving atmosphere convection, separation and closed loop ...
Fast Fire Furnace cover

Fast Fire Furnace

BTU’s Fast Fire furnace was developed with the process rigors of Thick Film processing in mind.  The Fast Fire offers unsurpassed thermal uniformity and the ...

Flux Removal Method for Reflow Furnaces

SMTAI - 2020 - Described in this work, is a novel method of capture which separates flux from the recirculating furnace gas using an aqueous ...

Flux Trap Lip Vent Upgrade

Reduces maintenance on facility exhaust and increases yield — For reflow ovens with or without flux management, the Flux Trap Lip Vent provides a way ...

Glass to Metal Sealing by a Single-Atmosphere, Single Firing Process

The International Journal for Hybrid Microelectronics - July 1988 --- A process is described whereby strong and hermetic matched seals can be fabricated in a ...
Health Check brochure cover

Health Check

Do you own an older BTU system?  You are not alone.  There are tens of thousands of BTU ovens and furnaces still operating in the ...
improving the reflow process p3 cover

Improving Reflow w/SPC Part III

Circuits Assembly - Feb 2002 --- The final part of the three-part series on using SPC to improve the reflow process.

Improving Reflow wSPC Part I

Circuits Assembly - Dec 2001 --- First of a three-part series on using SPC to improve the reflow process. In this article analytical tools are ...
improving the reflow process p2 cover

Improving Reflow wSPC Part II

Circuits Assembly - Jan 2002 --- This is the second article in the three-part seiries on using SPC in the reflow process. This article describes ...

Intellimax & Wincon Upgrade

WINCON™ is an advanced windows-based software system for controlling the operation of BTU thermal processing equipment. WINCON is used in conjunction with BTU’s proprietary INTELLIMAX™ ...
lead free solder wafter bump cover

Lead Free Solder Wafer Bumping – Oven Control and Solder Material Consistency Are Critical

Advanced Packaging - Sept 2004 --- A discussion on the transition to lead-free processing for wafer bump reflow with a focus on process control.

Maintaining Oven Performance while Reducing the Cost of Reflow

Reflow ovens are among the largest energy consumers in the SMT process, with nearly half of their operating time spent in non-processing modes such as ...
making a case for inline furnaces cover

Making A Case for Continuous Furnaces

Industrial Heating Magazine - Sept 2002 --- A continuous furnace is ideal for processes requiring high production volumes, process consistency,and precision control. This overview discusses ...
maximizing process control cover

Maximizing Process Control with Controlled Convection Rates

Reprinted from Global SMT & Packaging Magazine - Jan 2004 --- The effects of convection rate on process repeatability, peak temperature and thermal uniformity are ...

Nitrogen Fast Purge Upgrade

Allows faster start-up and recipe change over times through increased gas flow rates — The Nitrogen Fast Purge option allows users to return to production ...
operation of a vacuum reflow oven cover

Operation of a Vacuum Reflow Oven

In this presentation BTU's Fred Dimock explains the operation and configuration of an inline vacuum reflow oven. Included in this presentation is the preliminary voiding ...
affects of belt speed cover2

Oven Adjustment Effects on a Solder Reflow Profile

Circuits Assembly Magazine - Aug 2009 ---- This paper investigates the effects of variations on belt speed, static pressures, and zone temperatures on peak temperature, ...
oven selection lead free solder cover

Oven Selection and Lead-Free Solder

Global SMT & Packaging - Oct 2004 --- A discussion on the oven requirements for lead free solder. This article discusses issues like oven length, ...

Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed, Reflow Oven

Dual-lane reflow ovens have been available for years, permitting two boards to be run at the same time in parallel. Until recently, circuit board manufacturers ...
profile guardian brochure cover

Profile Guardian

Profile Guardian pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline – independent from control TCs. The redundant process ...
profile tracer cover

Profile Tracer

Profile Tracer supports Industry 4.0 capabilities by acquiring data sets, enabling data communication, and increasing database analysis using In-One-Pass (I-O-P) technology. Profile Tracer software is ...
profile tracer manual cover

Profile Tracer Manual

Download user manual for Profile Tracer software.
Pyramax brochure cover

Pyramax Reflow Oven

The Pyramax family of reflow ovens has long been the performance-leader in solder reflow with their unparalleled combination of thermal performance, versatility, and value. Pyramax ...
Pyramax TrueFlat cover

Pyramax TrueFlat Reflow Oven

Pyramax reflow ovens have a long and successful history in semiconductor packaging applications such as flip chip, curing, reflow and die attach applications. Requirements for ...
pyramax vacuum brochure cover

Pyramax Vacuum Reflow Oven

BTU’s Pyramax Vacuum reflow oven is a leading choice for manufacturers that need to minimize solder voiding. Solder voiding can be a life-limiting defect in ...
pyramax zeroturn cover

Pyramax ZeroTurn Dual Chamber Reflow Oven

Are you tired of waiting for your reflow oven to heat-up or cool-down?   With the Pyramax ZeroTurn you can have your next process already at ...
recipe pro brochure cover

Recipe Pro

RecipePro is the industry’s first recipe generator to include convection rate as part of the generator algorithm. Competitive solutions ignore convection rate, a key heat ...
reducing cte mismatch cover

Reducing CTE Mismatch Defects in Flip Chip Reflow

US Tech - May 2019 - In this article Thomas Tong and co-authors explain the use of the TrueFlat reflow oven technology to keep very ...
reducing reflow costs cover

Reducing Reflow Costs in a Challenging Economy

Presented at SMTA San Diego - Sept 2013 -- In this presentation, Fred Dimock, Manager Process Technology, discusses 10 methods that can be used to ...

SMT Magazine Step 7 Soldering

SMT Magazine - Aug 2004 --- Part of SMT Magazine's "step by step" series. The "Step 7" article covers soldering including a discussion on lead-free ...
smt reflow repeatability cover

SMT Reflow Oven-to-Oven Repeatability

In this article Fred Dimock, BTU’s Manager Process Technology, explains oven-to-oven repeatability across multiple SMT reflow oven process lines using a single process recipe. learn ...
tech bulletin FCU cover

Technical Bulletin: FCU Control Modules, Windows® XP and Windows ® 7

BTU’s older furnaces (from 1988 – 2002) utilized an FCU control module to communicate from the computer to the furnace. This technology was release more ...
thermal expertise cover

Thermal Expertise from Pilot to Production

Fully Customized Solutions | Superior Process Control — Continuous belt furnaces from BTU are known for long-term reliability, superior process performance, and service excellence. In ...
thermal processing expertise cover

Thermal Processing Expertise Reaches Across Industry Boundaries

USTech - July 2018 - Michael Skinner of USTech visted BTU's USA Headquarters, where custom belt furnaces have been manufactured for nearly 70 years. The ...
Thermal processing of metals brochure cover

Thermal Processing of Metals

Metals and metal alloys are often thermally processed to join parts, form components with a particular shape and dimensional tolerances, or to change physical properties ...
thermal profiles cover

Thermal Profiles – Why Getting Them Right is Important

Presented at ACI Technologies - Dec 2011 -- In this presentation, Fred Dimock, Manager Process Technology, gives a comprehensive overview of thermal profiling including: recipes ...
flux free wafer bump cover

Wafer Bump Reflow: Benefits of a Flux-Free Atmosphere

Advanced Packaging Magazine - July 2003 --- The article discusses the benefits of relflowing bumped wafers in a reducing atmosphere.
waver level packaging cover

Wafer Level Packaging

SECAP - 2005 --- A collection of papers on wafer level packaging and flip chip bumping covering a range of topics including plating, UBM, photolithography, ...