Improving Reflow wSPC Part I
Circuits Assembly – Dec 2001 — First of a three-part series on using SPC to improve the reflow process. In this article analytical tools are used to determine how all oven parameters are operating at the time an optimum oven profile is established.
Read MoreImproving Reflow wSPC Part II
Circuits Assembly – Jan 2002 — This is the second article in the three-part seiries on using SPC in the reflow process. This article describes the types of SPC tools that can be used to better understand the relationship between processing steps and how SPC, properly implemented, can track quality, monitor process deviations and increase…
Read MoreImproving Reflow w/SPC Part III
Circuits Assembly – Feb 2002 — The final part of the three-part series on using SPC to improve the reflow process.
Read MorePyramax Vacuum Reflow Oven
BTU’s Pyramax Vacuum reflow oven is a leading choice for manufacturers that need to minimize solder voiding. Solder voiding can be a life-limiting defect in assemblies where heat dissipation is a critical factor. Pyramax Vacuum has demonstrated its ability to reduce voiding levels well below 5%. BTU partnered initially with the Universal Advanced Process lab…
Read MoreCircuits Assembly Dimock Repeatability
SMT Reflow — Oven to Oven Repeatability: How to adjust an oven so a single recipe will work across multiple ovens for an individual product.
Read MoreAurora Reflow Oven
REFLOW IN A NEW LIGHT — Aurora is leading the way to the factory of the future by seeing reflow in a new light. Aurora, the newest reflow oven platform, from BTU is designed based on years of expertise and leadership from the makers of the industry’s best performing reflow ovens. As the latest in…
Read MorePyramax TrueFlat Reflow Oven
Pyramax reflow ovens have a long and successful history in semiconductor packaging applications such as flip chip, curing, reflow and die attach applications. Requirements for end-use devices continue to drive miniaturization while demanding greater semiconductor performance and capability. These requirements can create manufacturing challenges such as substrate warpage and die tilt. BTU’s new TrueFlat Technology…
Read MorePyramax ZeroTurn Dual Chamber Reflow Oven
Are you tired of waiting for your reflow oven to heat-up or cool-down? With the Pyramax ZeroTurn you can have your next process already at “ready” to prepare for instant changeover. The ZeroTurn features two completely separate process chambers. The chambers can be set for completely different process settings – have one chamber set…
Read MorePyramax Reflow Oven
The Pyramax family of reflow ovens has long been the performance-leader in solder reflow with their unparalleled combination of thermal performance, versatility, and value. Pyramax provides optimized lead-free processing, boosting productivity and efficiency. BTU’s exclusive closed loop convection control, provides precise heating and cooling control, constant heat transfer, maximum process control and reduced nitrogen consumption…
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