Reducing CTE Mismatch Defects in Flip Chip Reflow
US Tech – May 2019 – In this article Thomas Tong and co-authors explain the use of the TrueFlat reflow oven technology to keep very thin substrates flat during reflow. This is an important consideration for flip chip processes where CTE mismatch is an inherent process challenge. Learn more about substrate flatness during reflow This…
Read MorePyramax TrueFlat Reflow Oven
Pyramax reflow ovens have a long and successful history in semiconductor packaging applications such as flip chip, curing, reflow and die attach applications. Requirements for end-use devices continue to drive miniaturization while demanding greater semiconductor performance and capability. These requirements can create manufacturing challenges such as substrate warpage and die tilt. BTU’s new TrueFlat Technology…
Read MorePyramax Reflow Oven
The Pyramax family of reflow ovens has long been the performance-leader in solder reflow with their unparalleled combination of thermal performance, versatility, and value. Pyramax provides optimized lead-free processing, boosting productivity and efficiency. BTU’s exclusive closed loop convection control, provides precise heating and cooling control, constant heat transfer, maximum process control and reduced nitrogen consumption…
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