Reflow Oven Technology for Substrate Flatness
TrueFlat keeps ultra-thin substrates flat during reflow using recipe-controlled suction—no custom carriers, no vacuum pumps, just higher yield and unmatched planarity.
Semiconductor Advanced Packaging and Warpage Control for Very Thin Substrates Pyramax TrueFlat is a purpose-built reflow oven for advanced semiconductor packaging, designed to address die tilt and substrate warpage without adding complexity to your process.
Using recipe-controlled suction across a dual-lane conveyor, it delivers ultra-flat results while maintaining BTU’s signature thermal uniformity and throughput. Compatible with standard carriers and free of vacuum pumps, TrueFlat reduces cost, improves yield, and integrates seamlessly into high-volume lines.
Built on the industry-leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the Pyramax’s closed-loop convection heating.
The new Pyramax with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.
Why TrueFlat?
As semiconductor designs become smaller and more complex, maintaining flatness during reflow becomes critical. TrueFlat ensures thermal consistency across the board by applying a gentle, uniform suction throughout the process. This minimizes die tilt, improves yield, and preserves planarity for fine-pitch interconnects and advanced substrates.
Built-In Advantages
Engineered for ultra-flat results
Whether you're running flip chip, die attach, wafer-level packaging, or advanced SMT, TrueFlat delivers consistent, repeatable results. It’s already proven in high-precision manufacturing environments where z-axis control is essential.
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Flat Chip Assembly
Eliminate die tilt and ensure coplanarity
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Fine-Pitch QFN / BGA
Improve yield on sensitive packaging formats
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Die Attach
Precise substrate support for fragile components
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Advanced SMT
Control warpage on ultra-thin boards and carriers
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Wafer-Level Packaging
Ultra-flat results for high-density interconnects
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Panel-Level Processing
Uniform planarity across large-format substrates
Pyramax TrueFlat™ Reflow Oven Key Features & Innovations
Recipe-Controlled Suction
Closed-loop, programmable warpage control with 0.7–1.8 IWC range
No Vacuum Pump Required
Industry-first suction system without high-maintenance hardware
Standard Carrier Compatibility
Use existing tooling—no custom carriers needed
Dual-Lane Edge Transport
High-throughput conveyor system for parallel processing
Thermal Uniformity
Maintains Pyramax-level consistency across temperature zones
Seamless Integration
Fits within standard Pyramax footprint with full SECS/GEM support
Global Support, Industry-Leading Warranty
BTU reflow ovens and furnaces are backed by BTU’s global network of 24/7 service and technical support in over 50 countries. We stand behind our systems with the industry's best warranty:
- Lifetime on heaters and blowers
- 3 years on system components
- 1 year on labor
- BTU Production and Engineering Facilities
- BTU Regional Locations
- BTU Representatives
- 24/7 Worldwide Customer Support
- Manufacturing and Engineering in the US and China
- Process Applications Laboratories in the US and China
- Multiple Global training locations
Pyramax TrueFlat Specifications
| Feature | Specification |
|---|---|
| Model | Pyramax 150N |
| Atmosphere | Air or Nitrogen |
| Temperature Range | Operating 200–350°C (Rated to 350°C) |
| Suction Control | Recipe controlled, 0.7–1.8 IWC range |
| Transport System | Dual-lane rail edge conveyor |
| Substrate Thickness | ≤ 0.3 mm |
| Carrier Width | ≤ 160 mm per lane (custom widths available) |
Contact BTU to learn more about how the Pyramax TrueFlat reflow oven can end die tilt on your thin substrates.
Lower Energy. Less Downtime. Higher ROI.
Pyramax is designed to reduce total cost of ownership:
- Low nitrogen and power consumption
- Smart idle modes reduce energy during gaps
- "On the fly" maintenance keeps uptime high
- Stainless steel construction for longevity
- Optional high-power heaters and fine mesh belts for specialized applications
Standard Features
- Lead Free Process-Guaranteed
- 350ºC Maximum Temperature
- Forced Impingement Convection
- Programmable Heating and Cooling Rates
- Side to Side Gas Recirculation
- Low Nitrogen and Power Consumption
- Flexible Platform Configuration
- Automatic Width Adjust
- Dynamic Gas Idle
- Smart Product Tracking (SMEMA)
- WINCON Control Software
- Electronic Over-Temperature Safety System
Options
- Options
- 24 in Processing Capability
- 400ºC Maximum Temperature
- Belt and Rail Conveyors
- Fine Mesh Conveyor Belts
- Multiple Track Solution
- Flux Management
- Closed Loop Convection Control
- Integrated Water Supply
- Low Nitrogen Consumption Package
- High Power Heaters
- Center Supports
- Automatic Gas Sampling
- UL 508A and CE Compliant
- Automated Wafer Handling
- Barcode Reader
Purpose-built for thermal processes since 1988, WINCON™ delivers unmatched reliability, data accuracy, and system control with thousands of proven installations worldwide.
WINCON 8 features next-generation control with animated dashboards, SmartPower management, Energy Pilot cost savings, and RecipePro recipe generation. Fully Industry 4.0 ready with comprehensive connectivity through CFX, Hermes, OPC, REST, and MQTT protocols—enabling seamless MES integration, barcode support, and real-time traceability without proprietary middleware.
BTU is committed to helping manufacturers achieve their production and sustainability goals. By optimizing energy use, minimizing waste, and reducing downtime, our technologies support a lower total cost of ownership and a smaller environmental footprint.
From global OEMs to local contract manufacturers, BTU customers are leveraging these innovations to reduce costs and meet corporate sustainability targets. In many cases, budget is already allocated for energy and environmental improvements—making upgrades both good business and good citizenship.
Whether you're trying to improve your bottom line—or meet aggressive ESG targets—BTU’s platform of smart features makes it easy to do both.
Reduce running costs and energy waste.
Our EnergyPilot software automatically lowers power and process gas consumption during production gaps—cutting operating costs while maintaining peak performance. It’s an easy way to improve sustainability without sacrificing throughput.
Lower peak energy demand. Run smarter.
Smart Power dynamically limits your oven’s total power draw, reducing the connected load and helping you meet facility-level energy caps. It enables faster start-up and response—even when operating under power restrictions.
Efficient flux management with less waste.
Aqua Scrub neutralizes flux residue using a closed-loop, aqueous-based system—reducing emissions and maintenance while extending uptime. It supports a cleaner process with lower water usage and fewer disposables.
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