Aurora reflow oven platform

The Next Generation of Vacuum Reflow

Aurora Vacuum Reflow Oven Platform

Aurora Vacuum brings BTU's proven void-reduction technology to the Aurora platform — dual-lane vacuum processing, engineered for the smart factory and built on a legacy of thermal excellence.

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Dual-Lane Vacuum Processing in a Wider Chamber

Aurora Vacuum is BTU's next-generation vacuum reflow platform, designed for high-volume manufacturers who need void-free soldering without compromising throughput.

Built on the same dual-lane Aurora architecture that delivers superior thermal uniformity, integrated flux management, and smart energy-saving software, Aurora Vacuum adds a bell-jar vacuum chamber and recipe-controlled vacuum parameters proven on Pyramax Vacuum — now with two lanes of vacuum throughput and a wider chamber for larger boards.

That shift matters because single-lane vacuum chambers can become a production bottleneck at scale — as volumes grow and packages get larger, manufacturers are often forced to trade void-free quality for throughput. Aurora Vacuum's dual-lane chamber removes that tradeoff, so high-volume lines no longer have to choose.

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Aurora reflow oven platform
  • Dual-lane vacuum processing with a wider chamber for larger boards
  • Superior thermal uniformity
  • Flexible zone configurations
  • Fully updated user interface
  • Advanced flux management with built-in Aqua Scrub
  • Innovative Smart Power energy savings
  • MES/Factory integration

Designed for Maintenance Accessibility

The Aurora Vacuum chamber is designed to be opened wide for service without the use of tools, and the drive system within the vacuum chamber is easily removed for maintenance — minimizing time to repair on the component manufacturers rely on most.

  • Novel chamber opening mechanism
  • Removable drive system

Two Lanes. One Vacuum Chamber. No Compromise on Voids.

Aurora Vacuum redefines what's possible in vacuum reflow with dual-lane operation inside a single, wider vacuum chamber. Where Pyramax Vacuum processes one lane at a time, Aurora Vacuum can run two boards through vacuum simultaneously — or use the added chamber width to process larger boards that wouldn't fit before. The result: void reduction performance that no longer comes at the cost of throughput.
 

  • Dual-lane vacuum chamber — process two boards per vacuum cycle
  • Wider chamber envelope vs. Pyramax Vacuum's 457 x 457mm (18" x 18")
  • Built on Aurora's configurable conveyor platform

Redefining Vacuum Reflow The Next-Generation Successor, Built on a Legacy of Thermal Excellence

Aurora Vacuum builds directly on Pyramax Vacuum's proven bell-jar chamber and recipe-controlled vacuum process — the same technology BTU customers already rely on for void-free soldering — and re-engineers it for the Aurora platform's dual-lane throughput, wider chamber, and smart energy controls. It's the natural next step for manufacturers who trust Pyramax Vacuum today and need more capacity tomorrow.

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Optimized for your Application

Engineered for today's most demanding manufacturing challenges

From delicate ultra-thin substrates to high-mass server boards, Aurora is built to perform across a wide range of advanced electronics and semiconductor assembly applications—delivering exceptional precision, repeatability, and reliability where it matters most.

advanced packaging reflow

BTU Aurora and Pyramax reflow ovens deliver the thermal precision required for flip-chip, 2.5D/3D IC, and wafer-level packaging—with ultra-low oxygen levels, exceptional uniformity, and optional TrueFlat™ warpage control.

reflow for Panel-level packaging

 BTU Pyramax and Aurora reflow ovens deliver <4°C thermal uniformity across panels up to 700mm x 700mm, with inert atmosphere control, TrueFlat™ warpage elimination, and oven-to-oven repeatability for high-yield PLP production.

SMT reflow high volume

SMT Reflow

Run high-volume SMT lines with consistent throughput, superior zone control, and optional dual-lane configurations.

reflow for heavy boards

Any Board, Anytime, Anywhere — BTU Aurora and Pyramax ovens handle thick, high-mass PCBs with precision. Optimized convection and configurable options ensure consistent, reliable reflow for heavy server and power boards.

High mix manufacturing circuit boards

High-Mix Manufacturing

Adapt quickly to different board types and products with configurable zone layouts, conveyor options, and flexible automation.

power electronics and automotive

Power Electronics & Automotive

Support high-mass, high-reliability assemblies with excellent thermal uniformity and void-reducing process capabilities.

Vacuum Reflow: Eliminating Voids at the Source

Solder voids form during reflow from paste solvent and solids volatilization, oxide volatilization, and outgassing from the PCB or component. Left in place, voids in thermal pads and power packages block heat transfer and reduce reliability — a particular concern for QFN, MLF, and other thermally-critical devices.

Key benefits:

  • Reduces solder voids in thermal pads and power packages
  • Improves heat dissipation and long-term reliability
  • Backed by BTU's own Advanced Process Lab data, not just claims
  • Recipe-controlled — repeatable, not a manual add-on step

 

Vacuum reflow addresses this directly: applying a controlled vacuum to the molten solder joint pulls entrapped gas out before the joint solidifies. BTU's own trials at the Universal Instruments Advanced Process Lab, run across more than 200 boards with multiple pastes, board finishes, and pad designs, found:

  • Void levels dropped from ~20–39% at atmospheric pressure to under 2% in MLF100 packages at a hard vacuum of 20 Torr with a 30-second hold time.
  • Even a soft vacuum (245 Torr) and a short 5-second hold removed a meaningful share of voids.
  • Smaller components are easier to de-void than larger ones — a key reason vacuum reflow is especially valuable for large thermal pads and power packages.

Full data is available in BTU's whitepaper, "Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data."

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Aurora Reflow Oven Key Features & Innovations

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Dual-Lane Vacuum Processing

Run two boards per vacuum cycle, or process wider boards, in a single chamber — doubling vacuum throughput versus single-lane systems.

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Bell Jar Vacuum Chamber Design

The same proven chamber mechanism as Pyramax Vacuum, sized wider for Aurora Vacuum's dual-lane operation, for reliable vacuum sealing and trouble-free operation.

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Recipe-Controlled Vacuum Parameters

Vacuum level, hold time, pump-down, and equalization are all recipe-driven and repeatable — carried over from Pyramax Vacuum's proven process control.

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Superior Thermal Uniformity

Closed-loop convection control with side-to-side recirculation delivers consistent, high-precision thermal performance across every board. Repeatable results—system to system, site to site—reduce zone temperature set-points for unmatched efficiency.

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Configurable Heating and Cooling Zones

Aurora is the first reflow oven with factory-configurable heat and cooling zones. Tailor your system to handle heavy boards, slow cooling needs, or high-throughput lines—convert zones in two-zone increments.

Reflow flux management

This fully automatic, water-based system continuously removes flux contaminants from the oven atmosphere—reducing maintenance and keeping performance consistent regardless of flux type.

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Wincon delivers modern thermal control with a SEMI E95-style UI, light/dark mode, and full MES integration. Real-time diagnostics, barcode traceability, and custom alerts give operators total visibility.

Profile Guardian Reflow Oven Redundant Process Monitor

An integrated, redundant process monitor that tracks actual board-level performance versus recipe baselines. Enables full traceability when paired with barcode readers and supports MES data capture.

Smart Power

Smart Power

BTU’s exclusive Smart Power software reduces peak power draw, allowing for a lower connected load and faster response times. Automatically adjusts within a defined limit to optimize performance.

Energy Pilot

This intelligent energy-saving feature reduced energy consumption during production gaps by intelligently adjusting oven performance—then rapidly recovers to maintain profile integrity.

Global Support, Industry-Leading Warranty

BTU reflow ovens and furnaces are backed by BTU’s global network of 24/7 service and technical support in over 50 countries. We stand behind our systems with the industry's best warranty:

  • Lifetime on heaters and blowers
  • 3 years on system components
  • 1 year on labor

  • BTU Production and Engineering Facilities
  • BTU Regional Locations
  • BTU Representatives
  • 24/7 Worldwide Customer Support
  • Manufacturing and Engineering in the US and China
  • Process Applications Laboratories in the US and China
  • Multiple Global training locations

Ready to improve yield, reduce downtime, and optimize your reflow process?  Aurora is ready when you are.

Let’s talk about how Aurora can increase yield and reduce downtime in your facility.

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Purpose-built for thermal processes since 1988, WINCON™ delivers unmatched reliability, data accuracy, and system control with thousands of proven installations worldwide.

WINCON 8 features next-generation control with animated dashboards, SmartPower management, Energy Pilot cost savings, and RecipePro recipe generation. Fully Industry 4.0 ready with comprehensive connectivity through CFX, Hermes, OPC, REST, and MQTT protocols—enabling seamless MES integration, barcode support, and real-time traceability without proprietary middleware.

Compare Aurora Models

Aurora is available in multiple lengths and zone configurations to meet a variety of throughput and product needs. All models support nitrogen atmosphere, wide conveyor widths, and high product clearance.

Feature AURORA 125N50 AURORA 150N50 AURORA 175N75 AURORA 200N75
Atmosphere Nitrogen Nitrogen Nitrogen Nitrogen
Conveyor Speed 10–100 in/min (254–2540 mm/min)
Conveyor Width 24.4 in (620 mm)
Heated Length 125 in (3175 mm) 150 in (3810 mm) 175 in (4445 mm) 200 in (5080 mm)
Heated Zones (Top/Bottom) 10 / 10 12 / 12 14 / 14 16 / 16
Cooling Length 50 in (1270 mm) 50 in (1270 mm) 75 in (1905 mm) 75 in (1905 mm)
Cooling Zones 4 4 6 6
Total System Length 230.4 in (5852 mm) 255.3 in (6484 mm) 305.6 in (7762 mm) 330.5 in (8394 mm)
Total System Width 71.65 in (1820 mm)
Total System Height 62.8 in (1595 mm)
Product Clearance 3.15 in (80 mm)
Voltage Range 208–480 VAC

Find the Right Oven for Your Process

Find the Right Fit

How many zones do I need? How long should it be?
Use our configurator to determine the optimal reflow oven based on your product size and throughput.

Schedule a Live Demo

See Pyramax or Aurora in action.
Get a walkthrough of the features and options that matter to your process.

Talk to a Thermal Expert

Not sure where to begin?
We’ll help you choose the right reflow oven for your application and goals.

Sustainability Backed by ROI Minimize cost.
Maximize uptime.
Reduce environmental impact.

BTU is committed to helping manufacturers achieve their production and sustainability goals. By optimizing energy use, minimizing waste, and reducing downtime, our technologies support a lower total cost of ownership and a smaller environmental footprint.

From global OEMs to local contract manufacturers, BTU customers are leveraging these innovations to reduce costs and meet corporate sustainability targets. In many cases, budget is already allocated for energy and environmental improvements—making upgrades both good business and good citizenship.

Whether you're trying to improve your bottom line—or meet aggressive ESG targets—BTU’s platform of smart features makes it easy to do both.

Reduce running costs and energy waste.

Our EnergyPilot software automatically lowers power and process gas consumption during production gaps—cutting operating costs while maintaining peak performance. It’s an easy way to improve sustainability without sacrificing throughput.

Lower peak energy demand. Run smarter.

Smart Power dynamically limits your oven’s total power draw, reducing the connected load and helping you meet facility-level energy caps. It enables faster start-up and response—even when operating under power restrictions.

Efficient flux management with less waste.

Aqua Scrub neutralizes flux residue using a closed-loop, aqueous-based system—reducing emissions and maintenance while extending uptime. It supports a cleaner process with lower water usage and fewer disposables.

Schedule a demo

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